1. I-Physical Micromachining Technology
I-Laser Beam Machining: Inqubo esebenzisa amandla ashisayo aqondiswe nge-laser ukususa izinto endaweni yensimbi noma okungeyona eyensimbi, efaneleke kangcono izinto eziphukayo ezinokushintshwa kukagesi okuphansi, kodwa ingasetshenziselwa izinto eziningi.
Ukucutshungulwa kwe-ion beam: indlela ebalulekile yokwenza engajwayelekile yokwenziwa kwe-micro/nano.Isebenzisa ukugeleza kwama-ion asheshisiwe egumbini le-vacuum ukuze isuse, yengeze noma iguqule ama-athomu ebusweni bento.
2. Ubuchwepheshe be-Chemical micromachining
I-Reactive Ion Etching (RIE): inqubo ye-plasma lapho izinhlobo zezilwane zijatshuliswa ukukhishwa kwefrikhwensi yomsakazo ukuze kufakwe i-substrate noma ifilimu elincanyana ekamelweni lokucindezela okuphansi.Kuyinqubo ye-synergistic yezinhlobo ezisebenza ngamakhemikhali kanye nokuqhuma kwama-ion anamandla amakhulu.
I-Electrochemical Machining (ECM): Indlela yokukhipha izinsimbi ngenqubo ye-electrochemical.Ivamise ukusetshenziselwa ukukhiqiza ngobuningi bezinto eziqinile noma izinto okunzima ukuzisebenzisa ngezindlela ezijwayelekile.Ukusetshenziswa kwayo kunqunyelwe ezintweni zokuqhuba.I-ECM ingasika ama-engeli amancane noma anephrofayili, ama-contour ayinkimbinkimbi noma imigodi ngezinsimbi eziqinile nezingavamile.
3. Ubuchwepheshe bemishini ye-micromachining
Ukuphenduka kwedayimane:Inqubo yokuphendula noma yokwenza izingxenye ezinembayo kusetshenziswa amalebula noma imishini esuselwe efakwe amathiphu edayimane emvelo noma okwenziwa.
Ukugaya Idayimane:Inqubo yokusika engasetshenziswa ukukhiqiza ama-lens aspheric array usebenzisa ithuluzi ledayimane eliyindilinga ngokusebenzisa indlela yokusika indandatho.
Ukugaya Ngokunemba:Inqubo elimazayo evumela izinto zokusebenza ukuthi zenziwe ngomshini ukuze ziqedele kahle futhi zibekezelelane eduze kakhulu nokubekezelelana okungu-0.0001".
Ukupholisha:Inqubo elimazayo, ukupholishwa kwe-argon ion beam kuyinqubo ezinzile yokuqedela izibuko zetheleskopu kanye nokulungisa amaphutha ayinsalela asuka ekupholishweni komshini noma okokubona okujike ngedayimane, inqubo ye-MRF kwaba inqubo yokuqala enqumayo yokupholisha.Kwenziwa ukuhweba futhi kusetshenziselwa ukukhiqiza amalensi aspherical, izibuko, njll.
3. Ubuchwepheshe be-laser micromachining, obunamandla ngaphezu komcabango wakho
Lezi zimbobo emkhiqizweni zinezici zosayizi omncane, inombolo eminyene, nokunemba okuphezulu kokucubungula.Ngamandla ayo aphezulu, isiqondiso esihle nokuhambisana, ubuchwepheshe be-laser micromachining bungagxilisa i-laser beam ibe ama-microns ambalwa ububanzi ngohlelo oluthile lwe-optical.Indawo yokukhanya inokugxila okuphezulu kakhulu kokuminyana kwamandla.Izinto zizofinyelela ngokushesha endaweni yokuncibilika futhi zincibilike zibe yincibilika.Ngokuqhubeka kwesenzo se-laser, ukuncibilika kuzoqala ukuhwamuka, kubangele ungqimba oluhle lomhwamuko, kwakheke isimo lapho umhwamuko, okuqinile noketshezi kuhlangana khona.
Ngalesi sikhathi, ngenxa yomphumela wokucindezela kwe-steam, ukuncibilika kuzofafazwa ngokuzenzakalelayo, okwenza ukubonakala kokuqala komgodi.Njengoba isikhathi sokushiswa kwemisebe ye-laser sikhula, ukujula kanye nobubanzi be-microspores kuyaqhubeka nokukhula kuze kube yilapho i-laser irradiation iqedwa ngokuphelele, futhi ukuncibilika okungakafuthwanga kuzoqina ukwenza ungqimba lwe-recast, ukuze kuzuzwe ugongolo lwe-laser olungacutshunguliwe.
Ngokukhula kwesidingo se-micromachining yemikhiqizo enembayo ephezulu kanye nezingxenye zemishini emakethe, futhi ukuthuthukiswa kobuchwepheshe be-laser micromachining kuya ngokuya kukhula, ubuchwepheshe be-laser micromachining buncike ezinhlelweni zabo ezithuthukisiwe zokucubungula, ukusebenza kahle okuphezulu kanye nezinto ezisetshenziswayo.Izinzuzo zokuvinjelwa okuncane, akukho monakalo ngokomzimba, nokulawula okuhlakaniphile nokuguquguqukayo kuzosetshenziswa kabanzi ekucubunguleni imikhiqizo enembayo neyinkimbinkimbi.
Isikhathi sokuthumela: Sep-26-2022